Select a deceleration scheme.
I. Core Product Advantages: Compact structure and small size: Concentric shaft layout,
the volume is 30% to 50% smaller than the same level of reducer, saving installation
space and adapting to compact scenarios such as robot joints and AGVs.
High Torque Density: Multiple planetary gears are connected in parallel to share the load, with 3-4 gears meshing simultaneously.
For the same volume, the torque is 30%-50% higher than that of a parallel shaft reducer, achieving "small size, high torque."
High Precision, Low Backlash: Precision-ground gears + preloaded bearings reduce backlash to
**≤1 arcminute** (≤0.1 arcminute for high-end applications),
ensuring high repeatability and suitability for μm-level positioning scenarios.
High Transmission Efficiency: Single-stage efficiency **≥95%**, double-stage ≥92%, low power loss,
and significant energy savings over long-term operation.
High Rigidity, Impact Resistance: Multi-tooth meshing distributes the load, increasing rigidity
by 3-5 times, allowing it to withstand frequent start-stop cycles and impact loads, extending equipment lifespan.
Low Noise, Low Vibration: Smooth meshing reduces noise to below 65dB, suitable for low-noise
applications such as laser equipment and medical instruments.
Modular Design, Easy Maintenance: Standardized multi-stage design with a wide range of
selectable reduction ratios (3-1000), adaptable to different operating conditions, and easy maintenance.
II. Typical Industry Applications
Industrial Robots (approximately 30%)
Applications: Joints and drive units for six-axis articulated robots, SCARA, and Delta robots.
Requirements: Low backlash (≤1 arcminute), lightweight, high responsiveness,
and guaranteed repeatability accuracy of ±0.01mm.
III. CNC Machine Tools and Machining Centers
Applications: CNC rotary tables, tool magazines, spindle drives, ball screw feed modules.
Requirements: High rigidity, low backlash, improved indexing accuracy and cutting stability,
prevention of "missed steps," and assurance of μm-level machining accuracy.
IV. Semiconductor Equipment (approximately 16.15%)
Applications: Wafer handling robots, lithography equipment, testing instruments, vacuum platforms.
Requirements: Ultra-high precision (≤0.5 arcminutes),
adaptability to clean environments, low dust, and high stability.
V. Photovoltaic and New Energy Equipment
Applications: Photovoltaic trackers, silicon wafer cutting equipment,
energy storage systems, electric drives for new energy vehicles.
Requirements: High protection (IP65/67), weather resistance,
high transmission efficiency, suitable for outdoor and harsh operating conditions.
6. Laser Equipment (Cutting/Welding/Marking)
Applications: Motion modules, high-speed laser head drive, high-precision positioning platform.
Requirements: Low vibration, high dynamic response, ensuring
contour accuracy and cutting quality under high-speed start-stop conditions.
VII. Packaging and Food Machinery
Applications: High-speed packaging machines, labeling machines,
filling lines, pillow packaging machines.
Requirements: Low noise, high speed, high repeatability,
and adaptability to high-frequency start/stop and continuous operation.
VIII. Medical Equipment
Applications: Surgical robots, imaging equipment (CT/MRI),
rehabilitation equipment, precision medical instruments.
Requirements: Miniaturization, low noise, high precision,
clean and oil-free, suitable for sterile environments.
9. Construction Machinery and Engineering Machinery
Applications: Excavator slewing mechanisms, concrete pump truck booms,
cranes, road roller travel drives.
Requirements: High impact resistance, high protection (IP67),
heavy load capacity, adaptable to harsh working conditions such as sandstorms and mud.
10. Warehousing and Logistics (AGV / Stacker Crane / Conveyor Line)
Applications: AGV drive wheels, stacker crane lifting/movement,
heavy-duty conveyor lines, automated sorting machines.
Requirements: High efficiency, high torque, compact design,
suitable for long-term continuous operation and precise positioning.
Selection Considerations
Precision Class: For precision applications (semiconductors/lasers),
select ≤1 arcminute; for general automation, select ≤3-5 arcminutes.
Torque Matching: Select based on rated torque × 1.2-1.5, allowing for impact load margin.
Reduction Ratio: Match motor speed to load speed; commonly used
single-stage ratios are 3-10, and double-stage ratios are 12-100.
Installation Type: Linear (mainstream), right-angle (space-constrained),
flange/shaft output for different interfaces.